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    AN ANALYSIS OF INTERNAL VOIDS OF ORTHODONTIC ADHESIVES VIA MICRO-CT

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    Genre
    Thesis/Dissertation
    Date
    2019
    Author
    Britton, Steven Todd
    Advisor
    Orrego, Santiago
    Committee member
    Godel, Jeffrey H.
    Ginsberg, Gerald
    Sciote, James J.
    Department
    Oral Biology
    Subject
    Dentistry
    Adhesive
    Flash-free
    Micro-ct
    Orthodontic
    Void
    Permanent link to this record
    http://hdl.handle.net/20.500.12613/859
    
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    DOI
    http://dx.doi.org/10.34944/dspace/841
    Abstract
    Objectives: While bracket debonding has been explored through shear bond-strength tests with debonding linked to the type of material used, the technique of adhesive application, and contamination, the contribution of internal voids in orthodontic adhesives is unknown. Voids may result in fracture or bond-failure, either within the adhesive or at the tooth-adhesive-bracket interfaces. The aim of this thesis is to quantify the internal volumetric voids and bonding strength of three generations of bracket adhesives. Methods: Extracted third molars were bonded with three groups of orthodontic brackets including conventionally-pasted (CP), pre-coated (PC), or pre-coated flash-free (FF) (n=5 per group). The three-dimensional internal structure of the adhesive was evaluated with Micro Computed Tomography (micro-CT) using the Skyscan micro-CT (maximum resolution of 5 microns). Data from the micro-CT were analyzed with SkyScan software to perform 3D reconstructions, image processing, and qualitative and quantitative analysis of the adhesive’s structure. The amount of void was determined by measuring the percentage of voids at the bonded interfaces (Vint) and within the adhesive (Vbulk). The total amount of void was also calculated (Vtot= Vint+ Vbulk). Differences in void between the groups were assessed using one-way ANOVA with post-hoc Tukey tests (α=0.05). The bonding strength of the three adhesives systems was evaluated via shear bond strength tests. Results: Our void quantification results showed that FF brackets had a statistically higher (p0.05) for any the analyzed locations (Vint, Vbulk). Our results indicate the majority of voids were found at bonded interfaces (Vint) compared to within the bulk (Vbulk) for all three groups, with statistically significant (p<0.05) differences for CP and FF. Our bonding strength evaluation revealed the pre-coated group (PC) to have on average the highest bond strength compared to conventionally-pasted (CP) and pre-coated flash-free (FF) groups. Conclusions: The overall amount of void in the pre-coated flash-free adhesive brackets is significantly higher compared to conventionally-pasted and pre-coated groups. The majority of the void was identified to be located at the bonded interfaces (tooth/adhesive and bracket/adhesive) rather than within the bulk of the adhesive for all groups. Our bonding strength results indicate the pre-coated brackets to have the highest bond strength compared to pre-coated flash-free and conventionally-pasted. Our preliminary set of results indicate an inverse relationship between bonding strength and amount of void of brackets adhesives, with the pre-coated exhibiting the highest bond strength and least void. However, due to a limited sample size additional data are needed to validate these conclusions and find solid relationships between adhesive voids and bonding strength.
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