Novel phase diagram behavior and materials design in heterostructural semiconductor alloys
Genre
Journal articleDate
2017-06-07Author
Holder, Aaron M.Siol, Sebastian
Ndione, Paul F.
Peng, Haowei

Deml, Ann M.
Matthews, Bethany E.
Schelhas, Laura T.
Toney, Michael F.
Gordon, Roy G.
Tumas, William
Perkins, John D.
Ginley, David S.
Gorman, Brian P.
Tate, Janet
Zakutayev, Andriy
Lany, Stephan
Department
PhysicsSubject
Non-equilibrium materialsPhase diagrams
Semiconductor alloys
Materials design
Metastable materials
Alloy theory
Computational materials science
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http://hdl.handle.net/20.500.12613/8749
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https://doi.org/10.1126/sciadv.1700270Abstract
Structure and composition control the behavior of materials. Isostructural alloying is historically an extremely successful approach for tuning materials properties, but it is often limited by binodal and spinodal decomposition, which correspond to the thermodynamic solubility limit and the stability against composition fluctuations, respectively. We show that heterostructural alloys can exhibit a markedly increased range of metastable alloy compositions between the binodal and spinodal lines, thereby opening up a vast phase space for novel homogeneous single-phase alloys. We distinguish two types of heterostructural alloys, that is, those between commensurate and incommensurate phases. Because of the structural transition around the critical composition, the properties change in a highly nonlinear or even discontinuous fashion, providing a mechanism for materials design that does not exist in conventional isostructural alloys. The novel phase diagram behavior follows from standard alloy models using mixing enthalpies from first-principles calculations. Thin-film deposition demonstrates the viability of the synthesis of these metastable single-phase domains and validates the computationally predicted phase separation mechanism above the upper temperature bound of the nonequilibrium single-phase region.Citation to related work
American Association for the Advancement of ScienceHas part
Science Advances, Vol. 3, No. 6ADA compliance
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http://dx.doi.org/10.34944/dspace/8713
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