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dc.creatorIslam, Sayemul
dc.creatorGidde, Sai Teja Reddy
dc.creatorMajumdar, Anirvan Komath
dc.creatorLoh, Byoung Gook
dc.creatorHutapea, Parsaoran
dc.creatorKim, Albert
dc.identifier.citationIslam, S., Gidde, S. T. R., Majumdar, A. K., Loh, B. G., Hutapea, P., & Kim, A. (2018, October 17-20). Neuro-Needle Brain Deformation Quantification by Magnetic Sensor System [Conference presentation abstract]. 2018 Biomedical Engineering Society Annual Meeting, BMES 2018, Atlanta, GA.
dc.descriptionPresented at the 2018 Biomedical Engineering Society Annual Meeting, BMES 2018, which took place October 17-20, 2018, in Atlanta, GA.
dc.description.abstractIntraoperative brain deformation from neurosurgical needles or other load applying procedures can risk traumatic brain injury. Soft tissue, like the brain, is easily deformed even by light touch. Needle insertion leads to tissue rupture causing a sudden release of strain energy and the propagation of micro-cracks around the puncture site. The released strain energy is propagated along these cracks, causing neuronal and microvascular damage. Current image-guided neurosurgical procedures desperately lack information regarding micro level brain deformation, especially at the distal region of the needle penetration. As an imminent solution, collaborative approaches between current imaging technology and various brain deformation models have been reported. Unfortunately, computational models of brain deformation are unable to sufficiently account for the observed neuronal and microvascular damage. Thus, we report an implantable brain deformation sensing system that leads to a new micro level empirical brain deformation model. The hope is that our new empirical model will help better understand and mitigate tissue deformation at the distal region of the needle penetration site.
dc.format.extent1 page
dc.relation.ispartofFaculty/ Researcher Works
dc.rightsPublic Domain
dc.subjectSurgical technology
dc.subjectBiomedical engineering
dc.titleNeuro-Needle Brain Deformation Quantification by Magnetic Sensor System
dc.type.genreConference paper
dc.description.departmentMechanical Engineering
dc.ada.noteFor Americans with Disabilities Act (ADA) accommodation, including help with reading this content, please contact
dc.description.schoolcollegeTemple University. College of Engineering
dc.temple.creatorIslam, Sayemul
dc.temple.creatorGidde, Sai Teja Reddy
dc.temple.creatorMajumdar, Anirvan Komath
dc.temple.creatorHutapea, Parsaoran
dc.temple.creatorKim, Albert

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