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Reliability of Surface Mount Technology Packages Under Harsh Conditions
Bogicevic, Branko
Bogicevic, Branko
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Genre
Poster (Research)
Date
2006-02-11
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Committee member
Department
Mechanical Engineering
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DOI
http://dx.doi.org/10.34944/dspace/8172
Abstract
This work studies coupled influences of temperature, shock, and vibration using Finite Element (FE) analysis that is confirmed with experiments. Exposures of Surface Mounted Technology (SMT) packages to temperature changes induce thermal strains, largely due to the mismatch in Coefficients of Thermal Expansion (CTE's). Different strains of package constituents cause warpage which introduces thermomechanical loading on the solder joints. Such loading induces crack initiation and propagation, solder joint fatigue, and over time, leads to detachment of components. Other critical factors, particularly, shock and vibration could influence structural integrity of SMT packages. Preliminary results show that dimensional changes of the solder joints adversely affect the warpage.
Description
Poster presented at the AIAA/ASME 2nd Annual Aerospace & Mechanical Engineering Symposium, which took place February 11, 2006, in Plymouth Meeting, PA.
Citation
Bogicevic, B., & Hutapea, P. (2006, February 11). Reliability of Surface Mount Technology Packages Under Harsh Conditions. Poster presented at the AIAA/ASME 2nd Annual Aerospace & Mechanical Engineering Symposium, Plymouth Meeting, PA.
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